Chip packaging is an important part of the semiconductor manufacturing process. It refers to the packaging of a bare chip into a form that can be used in an electronic device. The process is designed to protect the chip from the surrounding environment (including physical and chemical influences), to ensure that the chip can be reliably connected to external circuits, and to provide the necessary thermal management. Therefore, chip packaging materials need to be characterized by high and low temperature resistance, high dielectric strength, good insulation and low stress.
YouXing Shark Chip Packaging Solutions
YouXing Sharks provides adhesives for Level 0, Level 1, and Level 2 chip packaging, including COB encapsulation adhesives, board level underfill adhesives, flip chip encapsulation adhesives, and component protection adhesives on FPC.
COB Encapsulation Adhesive 1161
Application Points
Chip encapsulation, IC and wafer protection.
Characteristics
High purity, low CTE, low shrinkage.
High Tg, high temperature resistance, good reflowability.
High reliability
Board Level Bottom Filler 1162
Application Points
BGA and CSP chip solder joint filling
Characteristics
Ultra-low viscosity, fast flow, good filling effect.
High Tg, high temperature resistant
Low CTE, low stress, low deformation.
Flip Chip Packaging Adhesive 1163
Application point
Underfill for Flip Chip
Characteristics
Low CTE, good heat resistance, high reliability.
● Good rheological properties, high purity.
Balanced performance, good toughness to reduce warpage while providing some structural strength.
Component protection adhesive on FPC 1164
Application Points
QFN component protection on FPC
Characteristics
Low temperature curing
● Good leveling
● Easy rework
● Low halogen
YouXing Sharks specializes in the development and application of adhesives for ICs and semiconductors, smart terminals, new energy and many other industries. Our professional R&D team is committed to providing customers with customized adhesive solutions, aiming to help customers reduce costs and increase efficiency, improve product reliability and durability, and enhance the brand value of their final products.
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